Logic Product Development Project
Device SN74LVC1G17DCK
Function Schmidt Trigger
Buffer
Competitor TI
Package DCK SOT353
SC-70
Die Size 509u X 494u cut size
Bond Pads 86 X 86 microns.
Die Orientation Active Surface Down (uses die that
normally faces down)
Technology LVC
5.5V to 1.65v
An online all
layer GIMP compatible photo set is on the server.
Die Photo Metal 2 |
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Die Overview
Observations: Photo
– High Resolution |
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Die Photo Metal 1 |
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Die Overview
Photo
– High Resolution |
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Die Photo Poly Level |
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Die Overview
Photo –
High Resolution |
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Die Photo Diffusion Level |
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Die Overview
Photo
– High Resolution |
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Package Information TI
SN74LVC1G17DCK SOT353 |
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Top View
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Bottom of package
with mold compound removed
This die has the pads oriented for a die downward application.
Note the pinout seems to differ since the photo on the left is a bottom view. |
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