Competitive Analysis

Logic Product Development Project

Device 74LVC1G04GW
Function Single Inverter with Schmitt Trigger Input

Datasheet local online

Competitor NXP

Package SOT353-1

Die Size 410u X 334u Thickness 192u

Die Orientation Active Surface Down

Technology LVC 5V to 1.65V

Die Photo
	Die Overview Observations: Active circuits under bond pads.

Die X-rays NXP 74LVC1G04GW
	Top of Package Looking Through Die Die is Down Observation: Large die mounting pad associated with pin Three.
	Side View
	Angled View Observation: The high-z material in the mount compound makes a noticeable oval apparition appear across top of die..

Package Details NXP 74LVC1G04GW
	Top View Size relative to 1mm on ruler.
	Top View Alternate
	Bottom